The University of Warwick Library - WebBridge
Fast 3D thermal simulation of power module packaging
Swan,
I. R. (Ian R.).
International Journal of Numerical Modelling : Electronic Networks, Devices and Fields.
v.
Vol.25.
no.
No.4.
2012-07.
p.
378 -
399...
issn:
0894-3370
.
Online access not found
Sorry - based on the information provided, WebBridge cannot offer appropriate links.
- If online access is not found this means that the Library's subscriptions do not cover access to the article. You may still be able to access it online if there is an open access version available.
- Check availability in Library Search to confirm whether we have the print journal at the Library or if we have online access to the journal but not for the year you required.
- When the Library has no access to a specific print or online article you can use Get it for me! to request a copy.