The University of Warwick Library - WebBridge

Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules
Ortiz Gonzalez, Jose Angel.  Microelectronics Reliability.  v. 64.   2016-09. p. 434 - 439... issn: 0026-2714 .   

Online access not found

Sorry - based on the information provided, WebBridge cannot offer appropriate links.